The technology of producing copper foam by Shanghai Winfay is built on a lace microstructure which improves properties found in standard metal foams. It represents a new lightweight / high performance wick platform that solves some of the most critical thermal management challenges in the electronics sector.Copper Foam are particularly fitted to replace the current copper powder-based wick structures used industry-wide in heat pipes and vapor chambers.

Below is the conventional evaluation of copper foam made by Shanghai Winfay.
Porosity:  5—120 PPI (pores per inch)
Density:  0.15~0.45g/cm3
Cavity:  90%—98%
Element:  Cu+Ni, Cu+Al, Cu+Zn
Volume:  600×500×1—100mm

Feature:
1. Excellent mechanical property and processability;
2. Extraordinary electricity and heat conductivity;
3. Massive intricate, lattice-like inner structure
4. The excellent ability of corrosion resistance, superior tensile strength, favorable ductility;
5. Magnificent electromagnetic shielding ability.

Special specification are available upon request.